Laser Direct Imaging Material and Process Developments for Next Generation Integrated Chipless RFID - LDI MAGIC

Project summary

The focus of LDI MAGIC is the development and fabrication design of innovative LTCC based mmW RFID-tags which are batteryless and chipless. These can be used for identification and precise localization at the same time, which is not possible in state-of-the-art RFID technology at low cost. The LTCC technology versatility allows the 3D integration of features like dielectric lenses, antenna arrays as well as resonators to store information. For this photoimageable pastes are necessary, which can be structured using laser direct imaging, for creation of very fine metallized structures down to 20 µm line and space it is possible to develop the next generation of RFID tags could support IoT applications, including warehouses, hospitals, logistic hubs (e.g. seaports, airports), industrial sites, smart cities, and autonomous vehicles using mmW radars that can rely on this approach to localize objects and people with high confidence and perform self-localization with increased reliability.

Project Details

Call

Call 2021


Call Topic

Functional materials


Project start

01.05.2022


Project end

30.04.2024


Total project costs

1.253.530 €


Total project funding

1.233.530 €


TRL

3 - 5


Coordinator

Dr. Stefan Körner

Fraunhofer IKTS, HANSASTRASSE 27C, 80686 MUNCHEN, Germany


Partners and Funders Details

Consortium Partner   Country Funder
Fraunhofer IKTS
https://www.ikts.fraunhofer.de/en.html
Research org. Germany DE-SMWK
Gdansk University of Technology
https://pg.edu.pl/en
University Poland PL-NCBR
ISS RFID Sp. z o.o.
https://www.issrfid.com
SME Poland PL-NCBR

Keywords

advanced multifunctional materials, multifunctional materials, remote sensing, embedded systems, tailored functionality