Copper conductive lines with glass insulation by a melt extrusion process - Coco

Project summary

Copper is the key element in renewable energy generation technologies, printed copper with high temperature dielectric is attracting increasing interest for power electronics and power generation applications. Aim of the Coco project is an innovative material concept for electronic applications, based on copper as highly conductive material and glass as a dielectric material for encapsulation at elevated temperatures. Objectives of the project are the development of the material concept for 3D parts with embedded electrical infrastructure and of high-throughput, energy and material efficient printing technologies to process these materials. Targeted results are a molten metal extrusion pro-cess fed by copper wire, a direct printing process for glass and a hybrid process for deposition of cop-per and glass in one machine. The feasibility of the material concept is demonstrated by means of electrodes for a highly sensitive, low-cost and reproducible electrochemical sensor.

Project Details

Call

Call 2022


Call Topic

Materials for electronics


Project start

01.05.2023


Project end

30.04.2026


Total project costs

1.438.702 €


Total project funding

1.407.595 €


TRL

1 - 5


Coordinator

Dr. Ines Dani

Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Reichenhainer Str. 88, 09126 Chemnitz, Germany


Partners and Funders Details

Consortium Partner   Country Funder
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
https://www.iwu.fraunhofer.de
Research org. Germany DE-SMWK
Technische Universität Bergakademie Freiberg
https://tu-freiberg.de/
University Germany DE-SMWK
MicruX Fluidic, S.L.
https://www.micruxfluidic.com/
SME Spain ES-IDEPA
Wroclaw University of Science and Technology
https://pwr.edu.pl/en/
University Poland PL-NCN

Keywords

additive manufacturing, electrochemical sensors, glass, hybrid material systems, material design, molten metal extrusion, interface design