Tellurium-Free Thermoelectric Modules by Interface Engineering - Thermos

Project summary

Thermoelectric (TE) technology offers solutions to solid-state heat recovery and cooling. Till now, only Bi2Te3 modules are commercially mature. Their applicability is limited by the scarcity and toxicity of tellurium (Te) with a concentration of <0.001 ppm in the earth’s crust. The replacement of Te will be addressed by THERMOS. As major objective THERMOS will develop highly efficient modules using atomic layer deposition and Te-free Zintl materials with a conversion efficiency of 8.5% and a cooling temperature of 65˚C to outperform Bi2Te3 modules. THERMOS will enable novel applications such as powering off-grid Internet-of-Things (IoT) nodes, energy harvesting from low-grade waste heat or cooling of medical devices. Joint efforts of research institutes from Germany and Spain, one university from the Czech Republic, and the Danish company TEGnology will impact the development and production of next-generation TE modules “Made in Europe” with better sustainability and performance.

Project Details

Call

Call 2021


Call Topic

Functional materials


Project start

01.07.2022


Project end

30.06.2025


Total project costs

1.371.590 €


Total project funding

1.205.257 €


TRL

2 - 6


Coordinator

Prof. Dr. Kornelius Nielsch

IFW Dresden, HELMHOLTZSTRASSE 20, 01069 DRESDEN, Germany


Partners and Funders Details

Consortium Partner   Country Funder
IFW Dresden
https://www.ifw-dresden.de
Research org. Germany DE-SMWK
CIC nanoGUNE
https://www.nanogune.eu
Research org. Spain ES-AEI
University of Pardubice
https://www.upce.cz
University Czech Republic CZ-TACR
Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM Dresden
https://www.ifam-dd.fraunhofer.de
Research org. Germany DE-SMWK
TEGnology ApS
https://www.TEGnology.dk
SME Denmark DK-IFD

Keywords

thermoelectric materials, thermoelectric power generation, nanostructured materials, atomic layer deposition, sustainable energy source, Zintl Phase Materials, Topological Insulator