Ultra-Low Temperature Co-fired Ceramics for 6th Generation Electronic Packaging - ULTCC6G_EPac

Project summary

Information and communication technologies for 5G and 6G are today one of the most vital areas to address demand for energy efficiency, sustainability, environmental friendliness, low manufacturing cost, and circular economy. There is a great need for new or upgraded materials with specific properties and relevant technologies. The ULTCC6G-EPac will design, implement, validate, and demonstrate ultra-low temperature co-fired ceramics (ULTCC) fabricated at 400-700 °C, destined for multilayer high frequency (GHz-THz) devices. It implements new functional materials, facile ceramic tapes, and upgraded ULTCC packages (RoHS and REACH compliant) useful for 6th generation devices in telecommunication K band and D band. Structural, microwave and mmWave dielectric, thermal and mechanical materials properties will be studied. Consortium will develop new materials (IKTS,DE), characterize (L-IMiF, QWED,PL), design, prototype and test the product in industrial environment (CEA Leti & INOVEOS, FR).