MultI-Scale Simulation Toolbox - MIST

Project summary

SiO2 is one of the most used coating deposited by Physical Vapor Deposition for various applications. Magnetron sputtering is popular in industry but then only thin layers are possible. An alternative is Plasma-Enhanced Chemical Vapor Deposition (PECVD) process based on hollow cathode source (HC). Deposition is possible at high rate for many days of continuous operation. Unfortunately, coating composition, uniformity and quality vary strongly with not well mastered process parameters. The aim of this project is to build an off-line digital twin of a HC PECVD process with advanced physical and chemical numerical models to simulate plasma, coating growth and predict film properties. The simulation framework will be a general toolbox with numerous possible applications of PECVD in solar, window film, glass, textile, and packaging industries. Here, it will be validated by experimental data obtained by one of the industrial partner in an industrial size HC source.